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Re: Question for our electronic experts
Posted by: Mark Goodson (IP Logged)
Date: July 05, 2006 08:12PM

For real, 3 different phenomenon in fact

Tin whiskers
Dendritic growth
Kirkenndall voiding.. (sic?) and Horsting voiding

The first two are more related to PCB's
The latter is a diffusion process on IC packages where the rate of diffusion of Al into Au is different than Au into Al... the results are voids in the ball bond / bonding pad, which leads to poor weld strength and possible catastrophic failure of the bond...


You can also throw in intermetallic contamination (if someone didn't clean the photo resist off a multi layer PCB w/ a plasma cleaner) and it makes for interesting failure analysis

To make matters worse, some are temperature dependent in their manifestations..



Subject Views Written By Posted
  Question for our electronic experts 1764 Nick Markowitz 07/05/2006 04:46PM
  Re: Question for our electronic experts 1310 John J. Lentini, CFEI 07/05/2006 05:10PM
  Re: Question for our electronic experts 1170 Mark Goodson 07/05/2006 08:12PM
  Re: Question for our electronic experts 1082 Richard C. Howard CFI,CFEI,K-9 07/05/2006 09:11PM
  Re: Question for our electronic experts 1085 Mark Goodson 07/06/2006 08:26AM
  Re: Question for our electronic experts 1088 Chris Bloom, CJBFireConsultant 07/06/2006 12:55AM


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