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Re: Question for our electronic experts
Posted by:
Mark Goodson (IP Logged)
Date: July 05, 2006 08:12PM
For real, 3 different phenomenon in fact
Tin whiskers
Dendritic growth
Kirkenndall voiding.. (sic?) and Horsting voiding
The first two are more related to PCB's
The latter is a diffusion process on IC packages where the rate of diffusion of Al into Au is different than Au into Al... the results are voids in the ball bond / bonding pad, which leads to poor weld strength and possible catastrophic failure of the bond...
You can also throw in intermetallic contamination (if someone didn't clean the photo resist off a multi layer PCB w/ a plasma cleaner) and it makes for interesting failure analysis
To make matters worse, some are temperature dependent in their manifestations..